Director, Advanced Packaging Lab (HIT)
AMD · Singapore · Engineering
About this role
AMD is hiring a director-level Director, Advanced Packaging Lab (HIT) based in Singapore. The posting calls out experience with Ray, AI Agents, Embedded Systems.
- Level
- director
- Location
- Singapore
- Department
- Engineering
- Posted
- May 17, 2026
More roles at AMD
Job description
from AMD careersWHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
AMD’s Heterogenous Technology Integration (HIT) team is seeking an experienced leader to establish its Singapore Advanced Packaging Lab, a multi-disciplinary lab focused on accelerating the development of advanced packaging technologies for AMD’s AI product portfolio.
THE PERSON: