Principal Engineer, HBM Design Quality Management

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron is seeking a Principal Engineer within the newly formed HBM Quality Management Systems (QMS) team to help establish, scale, and govern quality execution for next‑generation High Bandwidth Memory (HBM) products, with a strong emphasis on HBM design engineering precision and lifecycle governance.

This role is a foundational technical leadership position within HBM Engineering, centered on enabling disciplined, audit‑ready execution across the HBM design engineering lifecycle—from architecture and design requirements through implementation, signoff, bring‑up, and productization. You will serve as the HBM design engineering authority for QMS, ensuring alignment to international quality and cybersecurity standards while driving modernization of quality practices tailored to HBM’s system‑level challenges.

You will represent HBM Engineering in internal and external audits and work closely with HBM design engineering, validation, product engineering, and program teams to embed quality earlier in the development lifecycle (“shift left”), improving scalability, predictability, and tape‑out/release confidence.

You bring the technical depth, operational accuracy, and leadership presence required to run elite QMS operations in a fast paced HBM environment—and the influence to socialize future‑ready quality solutions across Micron engineering organizations.