Module Development Engineer
Intel · Hillsboro, OR
About this role
Intel is hiring a mid-level Software Engineer based in Hillsboro, OR. The posting calls out experience with Machine Learning, Data Analytics, System Design. Compensation is listed at $211,400–$298,440 per year.
- Role
- Software Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- Hillsboro, OR
- Posted
- May 18, 2026
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Job description
from Intel careersJob Description:
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
Required Skills and Experience
- Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions.