We are looking for an experienced Analog Design Engineer to drive the design and delivery of high‑speed interface IPs, with a strong emphasis on Die‑to‑Die (D2D) interconnects based on the UCIe standard and advanced package technologies. The role requires hands‑on ownership from architecture through silicon bring‑up, working closely with layout, verification, package, and system teams.

Key Responsibilities

Architect, design, and deliver high‑speed analog / mixed‑signal circuits for Die‑to‑Die and chiplet‑based systems, including UCIe‑compliant interfaces.
Own analog blocks for high‑speed interfaces such as clocking, TX/RX front‑ends, termination schemes, biasing, and equalization support circuits.
Drive architecture definition, feasibility analysis, and design trade‑offs considering signal integrity, power, noise, and packaging parasitics.
Perform schematic design, simulation, and optimization across PVT corners using industry‑standard EDA tools.
Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to co‑optimize circuit and package design.
Support layout reviews, parasitic extraction analysis, and post‑layout sign‑off for high‑speed performance.
Collaborate with AMS verification, digital, and system teams to enable full‑chip integration and validation.
Participate in silicon bring‑up, debug, and characterization, including correlation with simulation results.

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