Advanced Packaging Development Engineer
Broadcom · USA-CA Irvine Alton Parkway Bldg 2
About this role
Broadcom is hiring a mid-level Hardware Engineer in the software engineering function based in USA-CA Irvine Alton Parkway Bldg 2. Compensation is listed at $127,100–$203,400 per year.
- Role
- Hardware Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- USA-CA Irvine Alton Parkway Bldg 2
- Posted
- May 26, 2026
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Job description
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Job Description:
Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.
Key job scope includes
- packaging technology roadmap future product needs for 3-5 years
- support development of key components (HBM, iVR, Si Cap) for advanced packaging
- manage reliability test to qualify new technology
- lead yield improvement activities for new technology ramp-up
The job requires intensive experience in related area - such as 2.5D/3D and HBM technology development and reliability/yield improvements. Project management and team work skills are required. Strength in technology innovation, development, and enablement are key factors to consider.
A M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree) is required.
Additional Job Description:
Compensation and Benefits