Package Design Engineer
Broadcom · USA-CA San Jose Innovation Drive
About this role
Broadcom is hiring a mid-level Systems Engineer in the operations function based in USA-CA San Jose Innovation Drive. The role typically asks for 10+ years of relevant experience. Listed education preference: a bachelor's degree or equivalent. Compensation is listed at $141,300–$226,000 per year.
- Role
- Systems Engineer
- Function
- operations
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- USA-CA San Jose Innovation Drive
- Work mode
- On-site
- Experience
- 10+ years
- Education
- Bachelor's degree
- Posted
- Jun 1, 2026
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Job description
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Job Description:
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
RESPONSIBILITIES:
- Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, & track your work across 2+ projects simultaneously
- General flip-chip BGA package design & engineering
- Project management and customer interface for your design projects
- Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.