Process Integration Device Engineer

Job description

Responsibilities:

Role Purpose
Lead the development, integration, and transfer of HV/BCD semiconductor technologies, serving as the key technical interface between NXP and external foundries in China. This role ensures that process integration, device performance, and reliability fully meet NXP product and business requirements through strong device physics expertise and cross-functional leadership.

Process Integration & Technology Transfer

• Act as a Process Integration / Device Engineer in HV and BCD technology development and transfer projects.

• Ensure external foundries correctly understand and implement NXP technology and device requirements.

• Define and communicate technical specifications; review foundry implementations and assess alignment with NXP needs.

• Analyze process integration deviations and their impact on performance, yield, and reliability.

• Propose and drive corrective solutions to align foundry implementations with NXP standards.

Device & Physics Leadership

• Lead or strongly contribute to HV/BCD device architecture development and optimization (LDMOS, EDMOS, ESD).

• Analyze key device physics parameters including breakdown voltage (BV), Rdson, SOA, and reliability.

• Utilize TCAD (2D/3D) simulations to accelerate development cycles and root-cause analysis.

• Support device verification through statistical analysis of DOE and WAT data.

Cross-functional & External Collaboration

• Collaborate closely with internal Business, Design, Design Enablement, PI, and PE teams.

• Serve as the primary technical interface to foundries in China, leading technical discussions and decision-making.

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