Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)
Micron · Boise, ID
principal
software engineering
Principal Engineer
tech_leadership
5+ yrs Bachelor's
· Posted May 14, 2026
About this role
Micron is hiring a principal-level Principal Engineer in the software engineering function based in Boise, ID. The posting calls out experience with Frontend Development, Backend Development and roughly 5+ years of relevant work. Listed education preference: a bachelor's degree or equivalent.
- Role
- Principal Engineer
- Function
- software engineering
- Level
- principal
- Track
- Tech leadership
- Employment
- Full-time
- Location
- Boise, ID
- Work mode
- On-site
- Experience
- 5+ years
- Education
- Bachelor's degree
- Posted
- May 14, 2026
AI Summary
Principal Engineer leading process integration and structural uniformity for semiconductor memory manufacturing. Drives physics-based root cause analysis, inline monitoring strategies, and cross-site technical alignment to optimize yield and quality across DRAM/NAND production. Requires 5+ years semiconductor process experience, advanced degree, and travel to Micron sites.
More roles at Micron
Intern – Manufacturing Technician (CMP Process & Mechanical Design)
Singapore · junior
Data Analytics Deep Learning
Intern – Manufacturing Technician (Process and Production Analysis)
Singapore · junior
Deep Learning Data Analytics
Member Of Technical Staff - HBM Verification
Hyderabad, India · staff
Python
HIG HBM Staff Circuit Verification Engineer
Hyderabad, India · staff
System Design
Staff Engineer - STA/Synthesis
Hyderabad, India · staff
System Design
All Micron jobs →
Job description
from Micron careersOur vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
What’s Encouraged Daily:
- Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.
- Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
- Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp.
This is an excerpt. Read the full job description on Micron careers →