Thermal Compression Bonding Development Engineer

Job description

Job Description: 

The Role and Impact:

• Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.

• In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.

• With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation.

• This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.

Key Responsibilities:

• Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies.

• Apply statistical methods and principles of design of experiments (DOE) to establish and improve process specifications.

• Analyze process data to identify opportunities for improving quality, yield, productivity, and cost efficiency.

• Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs.

• Document technical advancements and improvements through white papers and reports.

Qualifications:

Minimum Qualifications:

• Possess a Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field.

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