CUF TD Module Engineer

Job description

Job Description: 

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.

• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.

• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

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