Module Development Engineer, Defect Inspection

Job description

Job Description: 

About the Role

Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes.

You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.

What You’ll Do

Key responsibilities will include but not limited to:

• Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
• Design and optimize processes, inspection methods, and equipment performance.
• Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC).
• Collaborate with equipment and materials suppliers to introduce new technologies.
• Analyze defect data to identify root causes and improve yield and quality.
• Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
• Support technology pathfinding and roadmap development for next-generation products.
• Stay current with industry trends, emerging tools, and inspection methodologies.

Behavioral traits that we are looking for candidates who:

• Collaborate effectively across teams and disciplines
• Show curiosity and continuous learning mindset
• Demonstrate strong analytical and problem-solving skills
• Can adapt to changing priorities in a dynamic environment
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