Overlay Metrology Engineer
IBM · Albany, United States
About this role
IBM is hiring a mid-level Data Analyst based in Albany, United States. The posting calls out experience with Data Analytics.
- Role
- Data Analyst
- Function
- data engineering
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- Albany, United States
- Posted
- May 18, 2026
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Job description
from IBM careersIntroduction
At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.
Your role and responsibilities
- Monitor and analyze overlay KPIs through daily performance readouts and weekly reports, identifying trends, root causes, and improvement opportunities.
- Provide real‑time line support for overlay metrology operations, addressing spec violations, measurement failures, tool behavior issues, and recipe-related constraints.
- Drive continuous improvement of overlay measurement robustness, precision, and stability across Image‑Based, SEM‑Based, and Diffraction‑Based overlay methodologies.
- Design, develop, and optimize overlay marks and KERF structures, ensuring compatibility with advanced device architectures and enabling high‑quality measurements across multiple metrology platforms.
- Create, refine, and maintain overlay measurement recipes, partnering closely with technicians to support complex or novel process layers.