Electrical Engineer - Dot
DoorDash · Oakland, CA · 311 Autonomy
About this role
DoorDash is hiring a mid-level Hardware Engineer in the software engineering function based in Oakland, CA. The posting calls out experience with Embedded Systems and roughly 3–7 years of relevant work. Listed education preference: a bachelor's degree or equivalent. Compensation is listed at $170,000–$250,000 per year.
- Role
- Hardware Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- Oakland, CA
- Experience
- 3–7 years
- Education
- Bachelor's degree
- Department
- 311 Autonomy
More roles at DoorDash
Job description
from DoorDash careers
About the Team
DoorDash Labs is a team within DoorDash building autonomous delivery robots and other autonomy solutions from the ground up for DoorDash's core delivery platform. If you have a passion for applying autonomy and robotics in a service used by millions of people daily, then we want to talk to you!
About the Role
We are seeking a hands-on Electrical Engineer to review the design, drawings, and schematics of the electrical systems for our 4-wheeled autonomous delivery robot. This role is responsible for delivering robust, production-ready hardware across high-speed digital design, PCBAs, RF integration, harnessing, and board-level packaging.
This is a deeply technical position for someone who can move seamlessly between system-level thinking and detailed circuit execution.
You're excited about this opportunity because...
- Develop electrical systems for a complex mobile robotic platform from concept through production.
- Lead high-speed digital design efforts (PCIe, MIPI, Ethernet, DDR, multi-gigabit SERDES, etc.).
- Own PCBA development including schematic capture, stack-up definition, layout guidance, impedance control, and design-for-manufacture.
- Drive RF integration (Wi-Fi, LTE/5G, GNSS, Bluetooth, RADAR, and LiDAR), antenna placement, layout constraints, and signal integrity.
- Develop and review cable harness designs, connector selection, grounding strategy, and environmental robustness.
- Collaborate closely with mechanical engineering on board packaging, thermal management, vibration resistance, and environmental sealing.