IC Package Mechanical FEA Engineer (R&D)

Broadcom · USA-Colorado-Fort Collins-4380 Ziegler Road

mid software engineering Hardware Engineer ic · Posted May 19, 2026
$108,000 – $172,800
USD per year

About this role

Broadcom is hiring a mid-level Hardware Engineer in the software engineering function based in USA-Colorado-Fort Collins-4380 Ziegler Road. Compensation is listed at $108,000–$172,800 per year.

Role
Hardware Engineer
Function
software engineering
Level
mid
Track
Individual contributor
Employment
Full-time
Location
USA-Colorado-Fort Collins-4380 Ziegler Road
Posted
May 19, 2026

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Job description

from Broadcom careers

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Job Description:

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs.  You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.  You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc).  Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages.  You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc..  

RESPONSIBILITIES:

  • Design responsibility for mechanical design aspects of ASIC packages

  • Use advanced FEA to quantify and optimize reliability and manufacturing

  • Measure and experiment to validate understanding and improve model accuracy

  • Collaborate closely with package designers, reliability and manufacturing partners (internal and external) 

    This is an excerpt. Read the full job description on Broadcom careers →