IC Packaging Engineer
Apple · Taipei, Taiwan · Hardware
About this role
Apple is hiring a mid-level Hardware Engineer in the software engineering function based in Taipei, Taiwan.
- Role
- Hardware Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Location
- Taipei, Taiwan
- Department
- Hardware
- Posted
- May 19, 2026
More roles at Apple
Job description
from Apple careersAt Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?
As IC packaging engineer, you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
Description
Explore and evaluate packaging technologies as our own packaging tool box. Define new package characteristics and specification based on unique module and system level performance, cost, and footprint.
Work with leading foundry & assembly suppliers on advanced organic and silicon interposer interconnect package development from design, new material, new equipment selection and establish robust process/process flow. Perform initial proof of concept sample build, process of record, package and process qualification, reliability test, yield analysis and continuous improvement.