Memory Packaging Engineer

Job description

Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions. In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products. You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling. Your ownership will span the entire product lifecycle, from initial concept through qualification. h3 Minimum Qualifications /h3 Minimum requirement of a bachelor's degree in a relevant field h3 Preferred Qualifications /h3 MS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding. Strong knowledge of packaging materials and design to engineer warpage and CTE…