IC Packaging Engineer, Materials and Packaging Characterization

Job description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products. As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness. h3 Minimum Qualifications /h3 BS and a minimum of 10 years relevant industry experience or equivalent h3 Preferred Qualifications /h3 BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment. Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM). Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities…