Process Development Engineer ( Precision Bonding )
Apple · Yokohama, Japan · Hardware
About this role
Apple is hiring a mid-level Manufacturing Engineer in the operations function based in Yokohama, Japan. The posting calls out experience with Data Analytics.
- Role
- Manufacturing Engineer
- Function
- operations
- Level
- mid
- Track
- Individual contributor
- Location
- Yokohama, Japan
- Department
- Hardware
- Posted
- Feb 18, 2026
More roles at Apple
Job description
from Apple careersWe bring amazing people together to make amazing things happen.
We’re a diverse collective of thinkers and doers, continuously reimagining our products and practices to help people do what they love in new ways. That innovation is inspired by a shared commitment to great work — and to each other. Because learning from the people here means we’re learning from the best.
The Camera Hardware Engineering group is responsible for the development of key technology for Apple products.
We are seeking an energetic and highly motivated bonding process engineer to work on advanced optical technology development.
Will you help us create the next generation of revolutionary Apple products?
You will lead the development and improvement of sub-micron order precision assembly processes, especially adhesive bonding and thermal compression bonding techniques for plastic materials, to realize new designs aimed at enhancing our product quality and performance. We are looking for individuals who can leverage cutting-edge technology and expertise to contribute to strengthening our competitive edge through innovative process development.
You will drive our precision process development, focusing on the following areas:
New Process Development: