IC Packaging Integration Engineer

Job description

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs h3 Minimum Qualifications /h3 BS and 10+ years of experience in relevant industry experience h3 Preferred Qualifications /h3 MS/PhD and 6+ years of experience in relevant industry. We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component system level reliability, testing, FA and package-system integration. Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density /…