Packaging Design Engineer
AMD · Hsinchu, Taiwan · Engineering
About this role
AMD is hiring a mid-level Hardware Engineer in the software engineering function based in Hsinchu, Taiwan. The posting calls out experience with Embedded Systems.
- Role
- Hardware Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Location
- Hsinchu, Taiwan
- Department
- Engineering
- Posted
- May 19, 2026
More roles at AMD
Job description
from AMD careersWHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
The AMD Adaptive and Embedded Computing Group is seeking an experienced and self-motivated package design engineer. As a key member of the Package/Board group, you will work across chip, technology and systems teams to define cost effective and high performance solutions.
THE PERSON:
This is a high visibility position working on custom ASIC packages that include FPGA IP. The ideal candidate should have the ability to understand electrical requirements and translate to the proper package technology requirements that is cost effective and manufacturable. This role requires good communication skills to work with other teams and engineers at the various design centers to carry the projects from design start to signoff stages.