Packaging Engineer, Device Packaging Experience, Device Packaging Experience
Amazon · Shenzhen, China · Hardware Development
About this role
Amazon is hiring a mid-level Hardware Engineer in the software engineering function based in Shenzhen, China.
- Role
- Hardware Engineer
- Function
- software engineering
- Level
- mid
- Track
- Individual contributor
- Employment
- Full-time
- Location
- Shenzhen, China
- Department
- Hardware Development
- Posted
- May 21, 2026
More roles at Amazon
Job description
from Amazon careersJoin us in creating packaging solutions that delight customers every day—where your engineering expertise will drive innovation from initial concept through successful commercialization. As a Sr. Packaging Engineer, you'll lead high-impact projects that transform customer insights into breakthrough packaging designs, working backwards from customer needs to deliver exceptional unboxing experiences and product protection. Key job responsibilities As a Packaging Engineer, you will be responsible for working with US and regional teams, closely monitoring and driving packaging engineering initiatives and processes from concept through mass production. You will be an integral part of executing packaging build strategies, including Design For Manufacturing (DFM) innovation, new product development, builds, testing, and launch. You will be a critical escalation path for packaging process issues and work closely with China and US leadership teams to ensure cross-functional collaboration is effective. The Packaging Engineering team works closely with Design, Global Commodity Management, Supplier Quality Management, and Operations teams in the US and China throughout the design cycle. They are responsible for helping to drive the development of packaging part manufacturing and processes towards Marketing and ID intent. They are also responsible for participating in early engagement design recommendations, driving detailed engineering studies, and continuously driving towards…