Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging

Job description

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. We are seeking a Sr. Signal Power Integrity Engineer to join our hardware team and drive the SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs. In this role, you will own the package-level signal and power integrity strategy — from early architecture trade-offs through design closure, measurement and validation. You'll work at the intersection of IC, package, and board, ensuring our advanced packaging technologies meet dynamic performance, power delivery, and manufacturing targets. Key job responsibilities - Lead package-level SI/PI analysis for 2.5D, 3D-IC, fan-out, and silicon interposer/bridge architectures. - Design and optimize package stack-ups: dielectric material selection, impedance control, layer assignment, and RDL routing for high-speed and power delivery performance. - Perform high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces through the package. - Analyze…