Photolithography Process Engineer

Job description

Business Line Description:
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our customers. 

Job Summary:

Photolithography Process Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous experience with ASML Scanner, Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM or Archers is highly desirable.

Key Challenges:

• Reducing overall cost of non-conformal like wafer scrap, and photo rework
• Developing and writing standard work procedure document for Out of Control Action Plan
• Implementation of process SPC using Six-Sigma statistical methodology
• Process development and optimization utilizing Six-Sigma methodology
• Improving tool utilization and availability
• Working with manufacturing and industrial engineering for capacity planning and modeling
• Participating in and/or leading cross-functional and lean activity teams
• Supporting process development activities
• Sourcing and process releasing new equipment
• Training process technician in dispositioning of wafer in process out of control situations
• Training wafer FAB associate in process tool operation using our standard work process

Cross functional aspects:

• Working closely with Photo equipment team to identify and reduce source of process variation and implementing zero defect process
This is an excerpt. Read the full job description on NXP Semiconductors careers →